鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16" (4.06mm) from case for 10 seconds
0.113 (2.87)
0.103 (2.62)
0.145 (3.68)
0.135 (3.43)
0.560 (14.22)
0.530 (13.46)
0.410 (10.41)
0.390 (9.91)
PIN
2
0.635 (16.13)
0.625 (15.87)
1
0.160 (4.06)
0.140 (3.56)
0.560 (14.22)
0.530 (13.46)
3
0.350 (8.89)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.110 (2.79)
0.100 (2.54)
MECHANICAL DATA
0.105 (2.67)
0.095 (2.41)
0.037 (0.94)
0.027 (0.68)
0.105 (2.67)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
0.022 (0.56)
0.014 (0.35)
PIN 1
PIN 3
PIN 2
CASE
Dimensions in inches and (millimeters)
Case:
JEDEC TO-220AB molded plastic body over
passivated chips
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BYV32-50
BYV32-100
BYV32-150
BYV32-200
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=120擄C
Peak forward surge current
10ms single half sine-wave superimposed at
at T
J
=150擄C
Maximum instantaneous forward voltage per leg at:
I
F
=20A
I
F
=5.0A, T
J
=100擄C
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance per leg
T
C
=25擄C
T
C
=100擄C
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
18.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
I
FSM
150.0
Amps
V
F
1.15
0.85
10.0
600.0
25.0
45.0
20.0
3.0
-65 to +150
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
I
R
t
rr
C
J
R
螛JA
R
螛JC
T
J
, T
STG
Maximum reverse recovery time per leg
(NOTE 1)
(NOTE 2)
Maximum thermal resistance per leg
(NOTE 3)
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=1A V
R
=30V, di/dt=100A/碌s, Irr=10% I
RM
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to case per leg mounted on heatsink
4/98
1
2
