鈾?/div>
High temperature soldering guaranteed:
450擄C/5 seconds at terminals. Complete device
submersible temperature of 265擄C for 10 seconds
in solder bath
P
A
T
E
N
T
E
2nd BAND
D2
D1=
0.105
0.095
(2.67)
(2.41)
0.022 (0.56)
0.018 (0.46)
0.205 (5.2)
0.185(4.7)
1st band denotes type and positive end (cathode)
0
D2 = D1 + 0.008 (0.20)
-
2nd band denotes voltage type
MECHANICAL DATA
Case:
JEDEC DO-213AB molded plastic over glass body
Terminals:
Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity:
Two bands indicate cathode-end -1st band
denotes device type and 2nd band denotes repetitive peak
reverse voltage rating
Mounting Position:
Any
Weight:
0.0046 ounce, 0.116 gram
Dimensions in inches and (millimeters)
by
Patent No. 3,996,602 and brazed-end cap assembly by Patent No. 3,930,306
*
Glass-plastic encapsulation technique is covered
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
BYM10
SYMBOLS
BYM10
-800
-1000
GL41K GL41M GL41T
UNITS
GL41Y
Standard recovery device: 1st band is white
Polarity color bands (2nd Band)
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
(SEE FIG. 1)
-50
-100
-200
-400
-600
GL41A GL41B GL41D GL41G GL41J
Gray
Red
Orange Yellow Green
Blue
Violet
White Brown
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
1.0
800
560
800
1000
700
1000
1300 1600
910
1120
1300 1600
Volts
Volts
Volts
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum full load reverse current
full cycle average at T
A
=75擄C
Typical junction capacitance
(NOTE 1)
Typical thermal resistance
(NOTE 2)
(NOTE 3)
I
FSM
V
F
I
R
I
R(AV)
C
J
R
螛JA
R
螛JT
1.1
30.0
1.2
10.0
50.0
30.0
8.0
75.0
30.0
-65 to +175
Amps
Volts
碌A
碌A
pF
擄C/W
擄C
T
A
=25擄C
T
A
=125擄C
Operating junction and storage temperature range T
J
, T
STG
NOTES:
(1) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 V
DC
(2) Thermal resistance from junction to ambient, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
(3) Thermal resistance from junction to terminal, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
VISHAY
1
2
