鈾?/div>
High temperature soldering guaranteed:
450擄C/5 seconds at terminals. Complete device submersible
temperature of 260擄C for 10 seconds in solder bath
P
A
T
E
N
T
MECHANICAL DATA
Case:
JEDEC DO-213AA molded plastic over glass body
Terminals:
Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity:
Two bands indicate cathode end -1st band denotes device
type and 2nd band denotes repetitive peak reverse voltage rating
Mounting Position:
Any
Weight:
0.0014 ounce, 0.036 gram
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation is covered by
Patent No. 3,996,602 and brazed-lead assembly to Patent No. 3,930,306
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BYM07
-50
EGL34A
GRAY
BYM07
-100
EGL34B
RED
BYM07
-150
EGL34C
PINK
BYM07
-200
EGL34D
ORANGE
BYM07
-300
BYM07
-400
UNITS
Fast efficient device: 1st band is Green
Polarity color bands (2nd Band)
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
T
=75擄C
Peak forward surge current 8.3ms single half
sine-wave superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 0.5A
Maximum DC reverse current
at rated DC blocking voltage
Maximum full load reverse current,
full cycle average at T
A
=55擄C
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
EGL34F EGL34G
BROWN YELLOW
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
I
R(AV)
t
rr
C
J
R
螛JA
R
螛JT
T
J
, T
STG
50
35
50
100
70
100
150
105
150
0.5
200
140
200
300
210
300
400
280
400
Volts
Volts
Volts
Amp
Amps
10.0
1.25
5.0
50.0
50.0
50.0
7.0
150.0
70.0
-65 to +175
1.35
Volts
碌A(chǔ)
碌A(chǔ)
ns
pF
擄C/W
擄C
T
A
=25擄C
T
A
=125擄C
Maximum thermal resistance
(NOTE 3)
(NOTE 4)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
(4) Thermal resistance from junction to terminal, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
4/98
VISHAY
1
2
