Philips Semiconductors
Product specification
TrenchMOS鈩?transistor
Logic level FET
GENERAL DESCRIPTION
N-channel enhancement mode logic
level field-effect power transistor in a
plastic envelope suitable for surface
mounting. Using 鈥檛rench鈥?technology
the device features very low on-state
resistance. It is intended for use in
automotive and general purpose
switching applications.
BUK9635-100A
QUICK REFERENCE DATA
SYMBOL
V
DS
I
D
P
tot
T
j
R
DS(ON)
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
V
GS
= 5 V
V
GS
= 10 V
MAX.
100
40
150
175
35
34
UNIT
V
A
W
藲C
m鈩?/div>
m鈩?/div>
PINNING - SOT404
PIN
1
2
3
mb
gate
drain
(no connection possible)
source
drain
DESCRIPTION
PIN CONFIGURATION
mb
SYMBOL
d
g
2
1
3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
V
DS
V
DGR
鹵V
GS
鹵V
GSM
I
D
I
D
I
DM
P
tot
T
stg
, T
j
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Non Repetive gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
CONDITIONS
-
R
GS
= 20 k鈩?/div>
-
-
T
mb
= 25 藲C
T
mb
= 100 藲C
T
mb
= 25 藲C
T
mb
= 25 藲C
-
MIN.
-
-
-
-
-
-
-
-
- 55
MAX.
100
100
10
15
40
29
133
150
175
UNIT
V
V
V
V
A
A
A
W
藲C
THERMAL RESISTANCES
SYMBOL
R
th j-mb
R
th j-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
-
Minimum footprint, FR4
board
TYP.
-
50
MAX.
1.01
-
UNIT
K/W
K/W
August 1999
1
Rev 1.000
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