The SOT-223 Package can be soldered using wave or reflow. The formed leads
鈥?/div>
Available in 12 mm Tape and Reel
Use BCP53T1 to order the 7 inch/1000 unit reel.
Use BCP53T3 to order the 13 inch/4000 unit reel.
COLLECTOR 2,4
BCP53T1
Motorola Preferred Device
MEDIUM POWER
PNP SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
4
1
BASE
1
EMITTER 3
2
3
CASE 318E-04, STYLE 1
TO-261AA
MAXIMUM RATINGS
(TC = 25擄C unless otherwise noted)
Rating
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current
Total Power Dissipation @ TA = 25擄C(1)
Derate above 25擄C
Operating and Storage Temperature Range
Symbol
VCEO
VCBO
VEBO
IC
PD
TJ, Tstg
Value
鈥?80
鈥?00
鈥?5.0
1.5
1.5
12
鈥?65 to 150
Unit
Vdc
Vdc
Vdc
Adc
Watts
mW/擄C
擄C
DEVICE MARKING
AH
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance 鈥?Junction-to-Ambient (surface mounted)
Lead Temperature for Soldering, 0.0625鈥?from case
Time in Solder Bath
Symbol
R
胃JA
TL
Max
83.3
260
10
Unit
擄C/W
擄C
Sec
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Thermal Clad is a trademark of the Bergquist Company
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 1
Motorola Small鈥揝ignal
漏
Motorola, Inc. 1996
Transistors, FETs and Diodes Device Data
1