applications. They are housed in the SOT鈥?16/SC鈥?5 package which
is designed for low power surface mount applications.
鈥?/div>
Device Marking:
BC847BTT1 = 1F
BC847CTT1 = 1G
1
BASE
COLLECTOR
3
2
EMITTER
MAXIMUM RATINGS
(TA = 25擄C)
Rating
Collector鈥揈mitter Voltage
Collector鈥揃ase Voltage
Emitter鈥揃ase Voltage
Collector Current 鈥?Continuous
Symbol
VCEO
VCBO
VEBO
IC
Max
45
50
6.0
100
Unit
V
V
V
mAdc
1
CASE 463
SOT鈥?16/SC鈥?5
STYLE 1
3
2
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR鈥? Board (1)
TA = 25擄C
Derated above 25擄C
Thermal Resistance,
Junction to Ambient (1)
Total Device Dissipation,
FR鈥? Board (2)
TA = 25擄C
Derated above 25擄C
Thermal Resistance,
Junction to Ambient (2)
Junction and Storage
Temperature Range
(1) FR鈥? @ Minimum Pad
(2) FR鈥? @ 1.0
脳
1.0 Inch Pad
Symbol
PD
200
1.6
R
胃JA
PD
300
2.4
R
胃JA
TJ, Tstg
400
鈥?5 to
+150
mW
mW/擄C
擄C/W
擄C
600
mW
mW/擄C
擄C/W
Max
Unit
DEVICE MARKING
See Table
ORDERING INFORMATION
Device
BC847BTT1
BC847CTT1
Package
SOT鈥?16
SOT鈥?16
Shipping
3000 / Tape & Reel
3000 / Tape & Reel
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
漏
Semiconductor Components Industries, LLC, 2000
1
May, 2000 鈥?Rev. 1
Publication Order Number:
BC847BTT1/D