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148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-148)

Dimensions shown in millimeters

9.10

9.00 SQ

8.90

A1 CORNER

INDEX AREA

16

14 12 10

15 13 11 9 8 7 6 5 4 3 2 1

BALL A1

PAD CORNER

TOP VIEW

7.50

BSC SQ

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

0.50 BSC

*1.40 MAX

DETAIL A

DETAIL A

*1.11 MAX

0.15 MIN

0.35

0.30

0.25

BALL DIAMETER

COPLANARITY

0.08

SEATING

PLANE

*COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION

TO DIMENSIONS INDICATED BY AN ASTERISK.

BC-148相關(guān)型號PDF文件下載

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• BC-148
  英文版
  148-Lead Chip Scale Package Ball Grid Array
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  BC-148
• BC-148
  英文版
  148-Lead Chip Scale Package Ball Grid Array
  AD [Analog...
  BC-148

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