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Lead-Free Solder Plating
http://onsemi.com
MAXIMUM RATINGS
(EACH DIODE)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM(surge)
Value
70
200
500
Unit
Vdc
mAdc
mAdc
5
ANODE
4
ANODE
BAV70DXV6T1
6
CATHODE
ANODE
1
2
ANODE
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance -
Junction-to-Ambient
Characteristic
(Both Junctions Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance -
Junction-to-Ambient
Junction and Storage
Temperature Range
1. FR-4 @ Minimum Pad
R
qJA
T
J
, T
stg
T
A
= 25擄C
R
qJA
A
= 25擄C
Symbol
P
D
Max
357
(Note 1)
2.9
(Note 1)
350
(Note 1)
Max
500
(Note 1)
4.0
(Note 1)
250
(Note 1)
- 55 to +150
Unit
mW
mW/擄C
擄C/W
3
CATHODE
6
54
2
3
1
Symbol
P
D
Unit
mW
mW/擄C
擄C/W
SOT-563
CASE 463A
PLASTIC
MARKING DIAGRAM
A4 D
擄C
A4 = Specific Device Code
D = Date Code
ORDERING INFORMATION
Device
BAV70DXV6T1
BAV70DXV6T5
Package
SOT-563
SOT-563
Shipping
4 mm pitch
4000/Tape & Reel
2 mm pitch
8000/Tape & Reel
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2003
1
March, 2003 - Rev. 1
Publication Order Number:
BAV70DXV6T1/D