BAT54TW /ADW /CDW /SDW
/BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
NEW PRODUCT
Features
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Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and
ESD Protection
SOT-363
A
Dim
A
B
Min
0.10
1.15
2.00
0.30
1.80
戮
0.90
0.25
0.10
0擄
Max
0.30
1.35
2.20
0.40
2.20
0.10
1.00
0.40
0.25
8擄
TOP VIEW
B C
C
D
F
H
M
Mechanical Data
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Case: SOT-363, Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Orientation: See Diagrams Below
Weight: 0.006 grams (approx.)
Marking: See Diagrams Below & Page 2
A
1
0.65 Nominal
G
H
K
J
K
L
M
a
J
D
F
L
All Dimensions in mm
AC
1
C
2
C
2
C
1
A
2
A
2
C
2
A
2
AC
1
C
1
C
2
C
1
C
2
C
3
C
1
C
1
A
2
A
1
A
1
C
2
A
1
C
1
AC
2
A
1
A
2
AC
2
A
1
A
2
A
3
BAT54CDW*
BAT54ADW*
Marking: KL7
Marking: KL6
*Symmetrical configuration, no orientation indicator.
BAT54SDW*
Marking: KL8
BAT54BRW
Marking: KLB
BAT54TW
Marking: KLA
Maximum Ratings
@ T
A
= 25擄C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
I
F
I
FRM
@ t < 1.0s
I
FSM
P
d
R
qJA
T
j
, T
STG
Value
30
200
300
600
200
625
-65 to +125
Unit
V
mA
mA
mA
mW
擄C/W
擄C
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 1)
Repetitive Peak Forward Current (Note 1)
Forward Surge Current (Note 1)
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
@ T
A
= 25擄C unless otherwise specified
Symbol
V
(BR)R
Min
30
Typ
戮
戮
戮
戮
戮
Max
戮
240
320
400
500
1000
2.0
10
5.0
Unit
V
Test Condition
I
R
= 100mA
I
F
= 0.1mA
1mA
I
F
=
I
F
= 10mA
I
F
= 30mA
I
F
= 100mA
V
R
= 25V
V
R
= 1.0V, f = 1.0MHz
I
F
= 10mA through I
R
= 10mA
to I
R
= 1.0mA, R
L
= 100W
Forward Voltage (Note 2)
V
F
I
R
C
T
t
rr
戮
戮
戮
戮
mV
Reverse Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Notes:
mA
pF
ns
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
DS30152 Rev. 7 - 2
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