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High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
E
N
T
E
P
A
T
1.0 (25.4)
MIN.
0.107 (2.7)
0.080 (2.0)
DIA.
0.205 (5.2)
0.160 (4.1)
1.0 (25.4)
MIN.
0.034 (0.86)
0.028 (0.71)
DIA.
NOTE:
Lead diameter is
0.026 (0.66)
0.023 (0.58)
for suffix "E" part numbers
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
MECHANICAL DATA
Case:
JEDEC DO-204AL molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce,0.3 gram
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BA157GP
BA158GP
BA159DGP
BA159GP
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current
10ms single half sine-wave superimposed
on rated load at T
A
=25擄C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage T
A
=25擄C
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
400
280
400
600
420
600
1.0
800
560
800
1000
700
1000
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
150
250
20.0
1.3
5.0
500
15.0
55.0
-65 to +175
500
Amps
Volts
碌A
ns
pF
擄C/W
擄C
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
1
2
