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Dual Band Handsets & PDAs
18 Pin
6 mm x 6 mm x 1.3 mm
Amplifier Module
PRODUCT DESCRIPTION
As with previous generations, the AWT6167
integrated CMOS power control scheme simplifies
the design of the transmitter by eliminating the need
for external power control circuitry.
The AWT6167 input and output terminals are internal
matched to 50 ohms and DC blocked, reducing the
V
CC2
number of external components required in the final
application. Both PA die, GSM900 and DCS, are
fabricated using state of the art InGaP HBT
technology, known for it is proven reliability and
temperature stability.
DCS
IN
B
S
TX
EN
MATCH
MATCH
DCS
OUT
CMOS BIAS/Integrated Power Control
V
BATT
V
REG
V
RAMP
GSM900
IN
V
CC_OUT
H(s)
MATCH
MATCH
GSM900
OUT
V
CC2
Figure 1: Block Diagram
01/2005