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APD032 Datasheet

  • APD032

  • PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS

  • 4頁

  • ETC

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I
NTRODUCTION
P
ACKAGE
M
ECHANICAL
S
PECIFICATIONS AND
P
ARAMETERS
1. Parameter Definitions:
A
= Distance from top of chip to top of glass.
a
= Photodiode Anode.
B
= Distance from top of glass to bottom of case.
c
= Photodiode Cathode
(Note: cathode is common to case in metal package products unless otherwise noted).
W
= Window Diameter.
F.O.V.
= Filed of View (see definition below).
2.
Dimensions are in inches (1 inch = 25.4 mm).
3.
Pin diameters are 0.018 鹵 0.001" unless otherwise specified.
4.
Tolerances
(unless otherwise noted)
General:
0.XX 鹵 0.01"
0.XXX 鹵 0.005"
鹵 0.010"
鹵 0.015"
Chip Centering:
Dimension `A':
5.
Windows
All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 鹵 0.002" thick.
All `XUV' products are provided with removable windows.
All `DLS' PSD products are provided with A/R coated glass windows.
All `FIL'
photoconductive
and
photovoltaic
products are epoxy filled instead of glass windows.
W
F .O .V .
A
F .O .V . = ta n
-1
[ W /2 A ]
UDT Sensors Inc.
Phone:
310-978-0516
Fax:
310-644-1727
http:\\www.udt.com
59

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