ACS541MS
January 1996
Radiation Hardened Octal Buffer/
Line Driver Three-State
Pinouts
20 LEAD CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR,
CDIP2-T20, LEAD FINISH C
TOP VIEW
OE1
A0
A1
A2
A3
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
20 VCC
19 OE2
18 Y0
17 Y1
16 Y2
15 Y3
14 Y4
13 Y5
12 Y6
11 Y7
Features
鈥?Devices QML Quali鏗乪d in Accordance with MIL-PRF-38535
鈥?Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96710 and Intersil鈥檚 QM Plan
鈥?1.25 Micron Radiation Hardened SOS CMOS
鈥?Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
鈥?Single Event Upset (SEU) Immunity: <1 x 10
-10
Errors/Bit/Day
(Typ)
鈥?SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm
2
/mg
鈥?Dose Rate Upset . . . . . . . . . . . . . . . . >10
11
RAD (Si)/s, 20ns Pulse
鈥?Dose Rate Survivability . . . . . . . . . . . >10
12
RAD (Si)/s, 20ns Pulse
鈥?Latch-Up Free Under Any Conditions
鈥?Military Temperature Range . . . . . . . . . . . . . . . . . . -55
o
C to +125
o
C
鈥?Signi鏗乧ant Power Reduction Compared to ALSTTL Logic
鈥?DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
鈥?Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
鈥?Input Current
鈮?/div>
1碌A(chǔ) at VOL, VOH
鈥?Fast Propagation Delay . . . . . . . . . . . . . . . . 17ns (Max), 12ns (Typ)
GND 10
20 LEAD CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR,
CDFP4-F20, LEAD FINISH C
TOP VIEW
OE1
A0
A1
A2
A3
A4
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
OE2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Description
The Intersil ACS541MS is a Radiation Hardened Octal Buffer/Line
Driver, with three-state outputs. The output enable pins OE1, OE2 con-
trol the Three-State outputs. If either enable is high the output will be in a
high impedance state. For data output both enables must be low.
The ACS541MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of a radiation hardened,
high-speed, CMOS/SOS Logic family.
The ACS541MS is supplied in a 20 lead Ceramic Flatpack (K suf鏗亁) or a
Ceramic Dual-In-Line package (D suf鏗亁).
A5
A6
A7
GND
Ordering Information
PART NUMBER
5962F9671001VRC
5962F9671001VXC
ACS541D/Sample
ACS541K/Sample
ACS541HMSR
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
25
o
C
25
o
C
25
o
C
SCREENING LEVEL
MIL-PRF-38535 Class V
MIL-PRF-38535 Class V
Sample
Sample
Die
PACKAGE
20 Lead SBDIP
20 Lead Ceramic Flatpack
20 Lead SBDIP
20 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright 漏 Intersil Corporation 1999
Spec Number
1
518856
File Number
4085
INTERSIL
1
2
3
