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Battery Packs
Battery-Powered Portable Equipment
Cellular and Cordless Telephones
TSOP-6 Package
Top View
D
6
D
5
S
4
Absolute Maximum Ratings
T
A
= 25擄C, unless otherwise noted.
Symbol
V
DS
V
GS
I
D
I
DM
I
S
T
J
T
STG
1
D
2
D
3
G
Description
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ T
J
= 150擄C
1
Pulsed Drain Current
2
Continuous Source Current (Source-Drain Diode)
1
Operating Junction Temperature Range
Storage Temperature Range
T
A
= 25擄C
T
A
= 70擄C
Value
-20
鹵12
鹵4.5
鹵3.6
鹵16
-1.3
-55 to 150
-55 to 150
Units
V
A
擄C
擄C
Thermal Characteristics
1
Symbol
R
胃JA
R
胃JA2
R
胃JF
P
D
Description
Junction-to-Ambient Steady State
Junction-to-Ambient t<5 Seconds
Junction-to-Foot
Maximum Power Dissipation
T
A
= 25擄C
T
A
= 70擄C
Typ
95
51
25
Max
115
62
30
2.0
1.3
Units
擄C/W
擄C/W
擄C/W
W
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. R
胃JF
+ R
胃FA
= R
胃JA
where the
foot thermal reference is defined as the normal solder mounting surface of the device's leads. R
胃JF
is guaranteed by design; however,
R
胃CA
is determined by the PCB design. Actual maximum continuous current is limited by the application's design.
2. Pulse test: Pulse Width = 300碌s.
8343.2005.04.1.0
1