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SOP-8L Package
Top View
D
8
D
7
D
6
D
5
Absolute Maximum Ratings
T
A
= 25擄C, unless otherwise noted.
Symbol
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
J
, T
STG
1
S
2
S
3
S
4
G
Description
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ T
J
=150擄C
1
Pulsed Drain Current
2
Continuous Source Current (Source-Drain Diode)
1
Maximum Power Dissipation
1
Operating Junction and Storage Temperature Range
T
A
= 25擄C
T
A
= 70擄C
T
A
= 25擄C
T
A
= 70擄C
Value
-20
鹵12
鹵6.5
鹵5.2
鹵32
-1.7
2.5
1.6
-55 to 150
Units
V
A
W
擄C
Thermal Characteristics
Symbol
R
胃JA
R
胃JA2
R
胃JF
Description
Typical Junction-to-Ambient Steady State
1
Maximum Junction-to-Ambient t<10 Seconds
1
Typical Junction-to-Foot
1
Value
80
50
27
Units
擄C/W
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 10-second pulse on a
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. R
胃JF
+ R
胃FA
= R
胃JA
where the
foot thermal reference is defined as the normal solder mounting surface of the device's leads. R
胃JF
is guaranteed by design; however,
R
胃CA
is determined by the PCB design. Actual maximum continuous current is limited by the application's design.
2. Pulse test: Pulse Width = 300碌s.
8107.2005.05.1.1
1