Part No. 95-132I25 - QFP to PGA Adapter
for JEDEC 132 Position, .025 [.64] Pitch
FEATURES:
鈥onvert surface mount QFP packages to a 13 x 13 PGA
footprint.
鈥?Reduce costs by using less expensive QFP packages to
replace PGA footprints in existing designs.
鈥?Pins are mechanically fastened and soldered to board
using Aries鈥?patented process, creating a reliable electrical
connection and rugged contact.
鈥?Consult factory for panelized form or for mounting of con-
signed chips.
SPECIFICATIONS:
鈥?Adapter body is black FR-4 with 1 ounce minimum Copper
traces.
鈥?Pads are bare Copper protected with Entek
廬
by Enthone to
eliminate coplanarity concerns and solder bridges
associated with hot air solder leveling.
鈥?Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
鈥?Pin plating is 200碌 [5.08碌m] min. 93/7 Tin/Lead per MIL-P-
81728 over 100碌 [2.54碌m] min. Nickel per QQ-N-290.
鈥?Operating temperature=221擄F [105擄C].
MOUNTING CONSIDERATIONS:
鈥?Suggested PCB hole size=.028 鹵 .003 [.71 鹵 .08] dia.
鈥?Will plug into standard PGA sockets.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
ORDERING INFORMATION
Specify Part No. 95-132I25
-or-
95-132I25-P for panelized form
when ordering
Specify Part Number 132-PGM13072-30
for wire wrap PGA socket
A
LL
DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Row-to-row:
Pin-to-pin:
All others:
Tolerances:
鹵 .003 [鹵 .08]
鹵 .003 [鹵 .08] non-cumulative
鹵 .005 [.13] unless otherwise specified
X-RAY VIEW TOP SIDE
QFP PAD ASSIGNMENT
TOP (QFP) SIDE
REV.D
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
http://www.arieselec.com 鈥?info@arieselec.com
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TEL: (908) 996-6841
FAX: (908) 996-3891
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FAX: +44 1653 600493
uking@arieselec.com
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FAX: +31 78 615 43 11
18017
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