max.
錛?/div>
7.0V
-55藲C to +125藲C
15 mA max. (1.5 MHz to 26.0 MHz)
10 mA max. (1.5 MHz to 26.0 MHz)
25 mA max. (26.0 MHz to 40.0 MHz) 35 mA max. (26.0 MHz to 50.0 MHz)
35 mA max. (40.0 MHz to 70.0 MHz) 50 mA max. (50.0 MHz to 70.0 MHz)
45 mA max. (70.0 MHz to 80.0 MHz) 60 mA max. (70.0 MHz to 80.0 MHz)
40% to 60% at 50%V
DD
level
6 ns max. (1.5 MHz to 36.0 MHz)
12 ns max. (1.5 MHz to 26.0 MHz)
4 ns max. (36.0 MHz to 80.0 MHz) 10 ns max. (26.0 MHz to 50.0 MHz)
(20%V
DD
to 80%V
DD
level)
6 ns max. (50.0 MHz to 80.0 MHz)
(10%V
DD
to 90%V
DD
level)
V
OL
: 10%V
DD
max.
V
OL
: 0.4V max.
V
OH
: 90%V
DD
max.
V
OH
: V
DD
-0.4V min.
30 pF max. (CMOS)
50 pF max. (1.5 MHz to 26.0 MHz)
30 pF max. (26.0 MHz to 50.0 MHz)
15 pF max. (50.0 MHz to 80.0 MHz)
100 ns max.
10 ms max.
鹵5
ppm max. at
錛?5藲C 鹵3藲C
for first year
錛?40藲C鹵5藲C
for 10 seconds
錛?50藲C鹵10藲C
for 1 to 2 minutes (preheating)
8.65
#1
#2
4.70max.
4.06
0.25min
0.51
7.62
#1
#2
Output (0藲C to
錛?/div>
70藲C)
Symmetry
Rise and fall times
#3
#4
5.08
PIN
1
2
3
4
CONNECTION
"L"
OPEN or "H"
GND
Z
OUTPUT
V
DD
Z: high impedance
"0" level
"1" level
Load
OUTPUT WAVEFORM
TR
V
OH
("1"Level)
TF
V
DD
90% or 80% V
DD
50% V
DD
V
OL
("0"Level)
GND
10% or 20% V
DD
OV DC
T
Symmetry=t/T 100(%)
脳
Enable/Disable delay time
Startup time
Aging
Reflow soldering condition
t
TEST CIRCUIT
Test Point
V
DD
A
#4
V
DD
PACKAGE DATA
Item
Lid
CL
Package
90SMO
Plastic
Press-fit (3
脳
9mm built-in)
Copper
Solder
#3
OUTPUT
GND
0.01 F鈭?.1 F
渭
渭
DC Power
Supply
V
TRI-STATE
E/D SW
#1
#2
Sealing
Terminal lead frame
Terminal plating
CL : including fixture and probe capacitance.
SOLDERING PATTERN
1.27
3.81 1.27
3.0
TAPE SPECIFICATIONS
4.0鹵0.1
0.1
蠁
1.5
+-
0
1.75鹵0.1
L
2.0鹵0.1
A
C
B
C
D
F
J
L
M Reel Dia. Qty/Reel
330
1000pcs
S O
5.80
D
3.0
0.01渭F
鈭?/div>
0.1渭F
M
14.3 10.1 24.0 11.5 12.0 1.6 0.4 5.0
A
J
B
F
5.08
CLK OSC
Actual Size
0藲C to
1
