8 PIN SOIC/SOIN PACKAGE OUTLINE
3
D
e
8
H
SEE DETAIL "A"
0.25
3
E1
E
GAUGE PLANE
L
5
INDEX AREA
(D/2 X E1/2)
1
2
8X b
2
4
4
c
L1
0擄-8擄
TOP VIEW
END VIEW
DETAIL "A" (SCALE: 3/1)
C
A2 A
SEATING PLANE
A1
ccc C
SIDE VIEW
3-D VIEW
Min
A
A1
A2
D
E
E1
L
L1
b
c
e
ccc
Notes:
-
0.31
0.17
1.35
0.10
1.25
4.80
5.80
3.80
0.40
Nominal
-
-
-
4.90
6.00
3.90
-
1.05 REF
-
-
1.27 BSC
-
Max
1.75
0.25
1.65
5.00
6.20
4.00
0.90
0.51
0.25
0.10
Remarks
Overall Package Height
Standoff
Package Body Thickness
"X" Body Size
Lead Span
"Y" Body Size
Lead Foot Length
Lead Length
Lead Width
Lead Thickness
Lead Pitch
Coplanarity
1. All dimensions are in millimeters.
2. True position spread tolerance of each lead is 鹵0.125mm at maximum material condition.
3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate
burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead
flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H".
4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
5. Details of pin 1 identifier are optional, but must be located within the index area indicated.
6. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
Rev. 8/23/05
1
