half-power devices. They combine Advanced
titanium-tungsten fuses. These devices will
logic.
programmability allow for quick design of 鈥漜ustom鈥?/div>
functions and typically results in a more compact
circuit board. In addition, chip carriers are
available for further reduction in board space.
The Half-Power versions offer a choice of
operating frequency, switching speeds, and
power dissipation. In many cases, these
Half-Power devices can result in significant power
reduction from an overall system level.
The PAL16鈥?M series is characterized for
operation over the full military temperature range
of 鈥?5擄C to 125擄C.
PAL16L8鈥?/div>
FK PACKAGE
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Copyright
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1992, Texas Instruments Incorporated
PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
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