74LVT16245 鈥?74LVTH16245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs
January 1999
Revised June 2005
74LVT16245 鈥?74LVTH16245
Low Voltage 16-Bit Transceiver with 3-STATE Outputs
General Description
The LVT16245 and LVTH16245 contain sixteen non-invert-
ing bidirectional buffers with 3-STATE outputs and is
intended for bus oriented applications. The device is byte
controlled. Each byte has separate control inputs which
can be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
The LVTH16245 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These non-inverting transceivers are designed for low-volt-
age (3.3V) V
CC
applications, but with the capability to pro-
vide a TTL interface to a 5V environment. The LVT16245
and LVTH16245 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16245),
also available without bushold feature (74LVT16245).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Outputs source/sink
32 mA/
64 mA
s
Functionally compatible with the 74 series 16245
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device
!
1000V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LVT16245GX
(Note 1)
74LVT16245MEA
(Note 2)
74LVT16245MTD
(Note 2)
74LVTH16245GX
(Note 1)
74LVTH16245MEA
(Note 2)
74LVTH16245MTD
(Note 2)
Package
Number
BGA54A
(Preliminary)
MS48A
MTD48
BGA54A
(Preliminary)
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1:
BGA package available in Tape and Reel only.
Note 2:
Devices also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
漏 2005 Fairchild Semiconductor Corporation
DS500152
www.fairchildsemi.com
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