bus oriented transmitter/receiver. The device is nibble con-
trolled. Individual 3-STATE control inputs can be shorted
together for 8-bit or 16-bit operation.
鈩?/div>
series resistance in both the HIGH and
LOW states of the output. This design reduces line noise in
applications such as memory address drivers, clock driv-
ers, and bus transceivers/transmitters.
The LVTH162244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT162244 and
LVTH162244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH162244),
also available without bushold feature (74LVT162244).
s
Live insertion/extraction permitted
s
Power Up/Power Down high impedance provides glitch-
free bus loading
s
Outputs include equivalent series resistance of 25
鈩?/div>
to
make external termination resistors unnecessary and
reduce overshoot and undershoot
s
Functionally compatible with the 74 series 162244
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
>
2000V
Machine model
>
200V
Charged-device
>
1000V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number
74LVT162244GX
(Note 1)
74LVT162244MEA
74LVT162244MEAX
74LVT162244MTD
74LVT162244MTDX
74LVTH162244GX
(Note 1)
74LVTH162244MEA
74LVTH162244MEX
74LVTH162244MTD
74LVTH162244MTX
Package
Number
BGA54A
MS48A
MS48A
MTD48
MTD48
BGA54A
MS48A
MS48A
MTD48
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBE]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tape and Reel]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBE]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tape and Reel]
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tube]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tape and Reel]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tube]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tape and Reel]
Note 1:
BGA package available in Tape and Reel only.
漏 2001 Fairchild Semiconductor Corporation
DS012445
www.fairchildsemi.com
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