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74LCX374SJX Datasheet

  • 74LCX374SJX

  • Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs a...

  • 12頁

  • FAIRCHILD

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74LCX374 Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
February 1994
Revised March 2005
74LCX374
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
General Description
The LCX374 consists of eight D-type flip-flops featuring
separate D-type inputs for each flip-flop and 3-STATE out-
puts for bus-oriented applications. A buffered clock (CP)
and Output Enable (OE) are common to all flip-flops. The
LCX374 is designed for low voltage (3.3V or 2.5V) V
CC
applications with capability of interfacing to a 5V signal
environment.
The LCX374 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V鈥?.6V V
CC
specifications provided
s
8.5 ns t
PD
max (V
CC
3.3V), 10
P
A I
CC
max
s
Power-down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
r
24 mA output drive (V
CC
3.0V)
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds JEDEC 78 conditions
s
ESD performance:
Human Body Model
!
2000V
Machine Model
!
200V
s
Leadless Pb-Free DQFN package
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX374WM
74LCX374SJ
74LCX374BQX
(Preliminary)
(Note 2)
74LCX374MSA
74LCX374MTC
74LCX374MTCX_NL
(Note 3)
Package
Number
M20B
M20D
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
MSA20
MTC20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 2:
DQFN package available in Tape and Reel only.
Note 3:
鈥淿NL鈥?indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
漏 2005 Fairchild Semiconductor Corporation
DS011996
www.fairchildsemi.com

74LCX374SJX 產(chǎn)品屬性

  • 2,000

  • 集成電路 (IC)

  • 邏輯 - 觸發(fā)器

  • 74LCX

  • 標(biāo)準(zhǔn)

  • D 型總線

  • 三態(tài)非反相

  • 1

  • 8

  • 150MHz

  • 8.5ns

  • 正邊沿

  • 24mA，24mA

  • 2 V ~ 3.6 V

  • -40°C ~ 85°C

  • 表面貼裝

  • 20-SOIC（0.209"，5.30mm 寬）

  • 帶卷 (TR)

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