鈩?/div>
(Enhanced-Performance Implanted
CMOS) 1-碌m Process
500-mA Typical Latch-Up Immunity at
125擄C
Package Options Include Shrink
Small-Outline 300-mil (DL) Packages Using
25-mil Center-to-Center Pin Spacings and
380-mil Fine-Pitch Ceramic Flat (WD)
Packages Using 25-mil Center-to-Center
Pin Spacings
54ACT16470 . . . WD PACKAGE
74ACT16470 . . . DL PACKAGE
(TOP VIEW)
description
The 鈥橝CT16470 are 16-bit registered transceivers
that contain two sets of D-type flip-flops for
temporary storage of data flowing in either
direction. They can be used as two 8-bit
transceivers or one 16-bit transceiver. Separate
clock (CLKAB or CLKBA) and output-enable
(OEAB or OEBA) inputs are provided for each
register to permit independent control in either
direction of data flow.
The A-to-B enable (CEAB) input must be low to
enter data from A or to output data to B. If both
CEAB and CLKAB are low, then B port will have
the level of A port prior to the most recent
low-to-high transition of CLKAB. Data flow from B
to A is similar, but requires the use of CEBA,
CLKBA, and OEBA inputs.
1OEAB
1CLKAB
1CEAB
GND
1A1
1A2
V
CC
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
V
CC
2A7
2A8
GND
2CEAB
2CLKAB
2OEAB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1OEBA
1CLKBA
1CEBA
GND
1B1
1B2
V
CC
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
V
CC
2B7
2B8
GND
2CEBA
2CLKBA
2OEBA
To avoid false clocking of the flip-flops, CE should not be switched from high to low while CLK is high.
The 74ACT16470 is packaged in TI鈥檚 shrink small-outline package, which provides twice the I/O pin count and
functionality of standard small-outline packages in the same printed-circuit-board area.
The 54ACT16470 is characterized for operation over the full military temperature range of 鈥?5擄C to 125擄C. The
74ACT16470 is characterized for operation from 鈥?0擄C to 85擄C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
Copyright
漏
1996, Texas Instruments Incorporated
鈥?/div>
DALLAS, TEXAS 75265
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