鈩?/div>
BiCMOS Design
Significantly Reduces Power Dissipation
Package Options Include Plastic
Small-Outline Packages (DW), Ceramic
Chip Carriers(FK), and Standard Ceramic
DIPs (JT)
SN54ABT8245 . . . JT PACKAGE
SN74ABT8245 . . . DW PACKAGE
(TOP VIEW)
DIR
B1
B2
B3
B4
GND
B5
B6
B7
B8
TDO
TMS
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OE
A1
A2
A3
A4
A5
V
CC
A6
A7
A8
TDI
TCK
SN54ABT8245 . . . FK PACKAGE
(TOP VIEW)
A8
TDI
TCK
NC
TMS
TDO
B8
NC 鈥?No internal connection
In the normal mode, these devices are functionally equivalent to the 鈥橣245 and 鈥橝BT245 octal bus transceivers.
The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins
or to perform a self test on the boundary-test cells. Activating the TAP in normal mode does not affect the
functional operation of the SCOPE
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octal bus transceivers.
Data flow is controlled by the direction-control (DIR) and output-enable (OE) inputs. Data transmission is
allowed from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at DIR. The
output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SCOPE and EPIC-螜螜B are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
B3
B4
GND
NC
B5
B6
B7
Copyright
漏
1996, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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