鈭掆垝鈭?/div>
0.30
0.40
0.50
PIN ONE
REFERENCE
2X
0.15 C
2X
0.15 C
0.10 C
8X
0.08 C
D2
8X
L
8X
K
STYLE 1:
PIN 1. IN
2. GND
3. CNTRL
4. DRAIN
5. SOURCE
6. GATE
7. OUT
8. VCC
1
2.95
2X
1.20
1.95
DIMENSIONS: MILLIMETERS
*For additional information on our Pb鈭扚ree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
鈥淐ONTROLLED COPY鈥?in red.
NEW STANDARD:
漏
Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DESCRIPTION: DFN8, 3.3X3.3 MM, 0.8 MM PITCH, DUAL FLAG
October, 2002 鈭?Rev. 0
PAGE 1 OF
XXX
2
1
DOCUMENT NUMBER:
98AON20636D
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脦脦
脧脧脧脧
脧脧脧脧
脧脧脧脧
脧脧脧脧
1
8
E
TOP VIEW
(A3)
A
GENERIC
MARKING DIAGRAM*
SIDE VIEW
A1
D2
4
e
XXXX
A
Y
WW
E2
= Specific Device Code
= Assembly Location
= Year
= Work Week
C
SEATING
PLANE
1
XXXX
AYWW
2X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb鈭扚ree indicator, 鈥淕鈥?or microdot 鈥?/div>
G鈥?
may or may not be present.
b
0.10 C A B
0.05 C
NOTE 3
5
8X
SOLDERING FOOTPRINT*
3.60
8X
BOTTOM VIEW
0.55
0.45
0.80
PITCH
2X
0.60
1
2
