PRODUCT INFORMATION
840
nm
4D470
PIN Array
Parallel Datacom, Telecom
M
ELI
PR
/
ARY
IN
This device consists of a 4-channel PIN
Photodiode array in a miniature sur-
face-mountable MT package. It is
based on a unique combination of self-
alignment technology and direct opti-
cal coupling to fiber, resulting in opti-
mum coupling efficiency without need
for active alignment. Applications
include parallel Fibre Channel and
optical interconnect inter/intra-board.
And it matches the 4D469 VCSEL
Array.
Optical and Electrical Characteristics
PARAMETER
SYMBOL
MIN.
TYP
.
MAX.
UNIT
(25擄C Case Temperature)
TEST CONDITION
Responsivity
Bandwidth
(3dBel )
Capacitance
Dark Current
Crosstalk
R
f
c
C
I
d
X
0.45
2
1
0.4
-30
A/W
GHz
pF
nA
dBel
=850nm
R
L
=50
f=1MHz
=850nm
(Note 1)
Test Condition:
VR=3.3V
or 5V. Fiber Ribbon: 50/125 GI, NA=0.2 or 62.5/125 GI, NA=0.275.
Note 1:
Crosstalk between adjacent channels operating at 2GHz.
Absolute Maximum Ratings
PARAMETER
SYMBOL
LIMIT
Storage Temperature
Operating Temperature
Reverse Voltage
Soldering Temperature
(2mm from the case for 10 sec)
T
stg
T
op
V
R
T
sld
-40 to +85 C
0 to +70 C
20V
260 C
Thermal Characteristics
PARAMETER
METAL SHIELD
SYMBOL
MIN.
TYP.
MAX.
UNIT
Temperature Coefficient - Dark Current
dI
d
/dT
j
5
%/ C
CATHODE
CATHODE
ANODES
FRONT VIEW
METAL SHIELD
HEAT SINK
MT GUIDE PINS
LEADS
SIDE VIEW
The cathode is connected to the metal shield
PIN Array in MT Package
13628.11 1999-01-13
All dimensions in mm
Europe:
Tel
(46) 8 58 02 45 00
Fax
(46) 8 58 02 01 10
Tel
(44) 1291 436180
Fax
(44) 1291 436771
America:
Tel
1-800-96MITEL
Fax
(613) 592-6909
Asia:
Tel
(65) 293 5312
Fax
(65) 293 8527
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