Power Dissipation, per Package鈥?/div>
Storage Temperature
mA
mW
Tstg
TL
鈥?65 to + 150
260
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = 鈥?55擄 to 125擄C for all packages.
_
C
_
C
BLOCK DIAGRAM
CX1
1
4
A1
5
B1
3
2
6
7
Q1
Q1
RX1
VDD
Lead Temperature (8鈥揝econd Soldering)
* Maximum Ratings are those values beyond which damage to the device may occur.
鈥燭emperature Derating:
Plastic 鈥淧 and D/DW鈥?Packages: 鈥?7.0 mW/
_
C From 65
_
C To 125
_
C
Ceramic 鈥淟鈥?Packages: 鈥?12 mW/
_
C From 100
_
C To 125
_
C
ONE鈥揝HOT SELECTION GUIDE
100 ns
MC14528B
MC14536B
MC14538B
MC14541B
MC4538A*
12
A2
11
B2
13
1
m
s
10
m
s
100
m
s
1 ms
10 ms
100 ms
1s
10 s
23 HR
5 MIN.
RESET 1
CX2
15
14
RX2
VDD
10
9
Q2
Q2
*LIMITED OPERATING VOLTAGE (2鈥? V)
TOTAL OUTPUT PULSE WIDTH RANGE
RECOMMENDED PULSE WIDTH RANGE
RESET 2
VDD = PIN 16
VSS = PIN 1, PIN 8, PIN 15
RX AND CX ARE EXTERNAL COMPONENTS
REV 3
1/94
漏
MOTOROLA CMOS LOGIC DATA
Motorola, Inc. 1995
MC14528B
1