鈥?/div>
3-Phase BLDC Motor Control
Fin Actuator Control
Antenna Deployment Control
Mirror Position Control
X-Y Table Control
Gimbal Stabilization Platform
Guidance System
DESCRIPTION
The 42144 Full Bridge Power Driver Hybrid is designed for high reliability applications in harsh environment. This
compact design offers a full-bridge power driver stage for three-phase brushless DC motor applications. The
circuit is electrically isolated from the metal case for ease of mounting in the system. The hybrid package provides
two mounting ears for ease of assembly and low thermal resistance path. Each phase contains a high-side gate
drive circuit for the P-channel power MOSFET, a series gate resistor for the low-side N-channel power MOSFET,
and three Schottky diodes. The high-side gate drive circuit accepts an open-collector signal of the application
controller circuit and generates required gate voltage to operate the high-side MOSFET. The low-side gate resistor
will prevent any oscillations and minimize ringing. As an option, a Schottky diode in series with the low-side
MOSFET insures that braking current will not flow backward through the N-channel MOSFET. Sources of the low-
side MOSFETs are terminated individually allowing user to configure the desired current sensing option.
Micropac 42144 Full Bridge Power Driver Hybrid employed selected components that are capable to perform in
radiation environment with minimum degradation. The hybrid will perform over the full military temperature range
of 鈥?5擄C to +125擄C. It is fabricated using DSCC certified manufacturing processes that are fully in compliance with
MIL-PRF-38534. This device is available in a variety of quality levels from COTS to Class K including any custom
screening requirements. The basic data sheet part is environmentally screened to H level in accordance with
Table C-IX of MIL-PRF-38534.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
M
................................................................................................................................................60 VDC
Peak Pulsed Output Current (< 1% duty cycle) .................................................................................................... 5 A
Dielectric Withstanding Voltage ......................................................................................................................... 500 VDC
Storage Temperature Range ................................................................................................................. -65潞C to +150潞C
Operating Junction Temperature.......................................................................................................... -55潞C to +150潞C
Lead Solder Temperature for 10 seconds ............................................................................................................. 300潞C
Junction-to case thermal resistance,
胃
J-C
.........................................................................................................TBD 潞C/W
Case Temperature................................................................................................................................................... 125潞C
WEIGHT:
.....................................................................................................................................TBD grams (typical)
Micropac Industries
cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac
reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION
鈥?/div>
905 E. Walnut St., Garland, TX 75040
鈥?/div>
(972) 272-3571
鈥?/div>
Fax (972) 494-2281
E-MAIL: HYBRIDSALES @ MICROPAC.COM
5/22/02
www.micropac.com
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