-28UNF, 0.625 in. thread depth
鈦?/div>
4
-28UNF, 0.625 in. thread depth
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
70擄C @ 15W
70擄 C @ 15W
70擄 C @ 15W
50擄 C @ 15W
50擄C @ 15W
5O擄C @ 15W
50擄C @ 15W
37擄 C @ 15W
37擄 C @ 15W
37擄 C @ 15W
37擄 C @ 15W
2.5擄 C/W @ 250 LFM
2.5擄 C/W @ 250 LFM
2.5擄 C/W @ 250 LFM
1.8擄 C/W @ 250 LFM
1.8擄C/W @ 250 LFM
1.8擄 C/W @ 250 LFM
1.8擄C/W @ 250 LFM
1.3擄 C/W @ 250 LFM
1.3擄 C/W @ 250 LFM
1.3擄 C/W @ 250 LFM
1.3擄 C/W @ 250 LFM
STUD-MOUNT
Weight
lbs. (grams)
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
Outline
Dimensions
in. (mm)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations (鈥淢M鈥?and
鈥淣N鈥?mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
MECHANICAL
DIMENSIONS
K
M
N
302 AND 303 SERIES
Dimensions: in. (mm)
301 SERIES
SERIES
301
302
303
641 SERIES
Standard
P/N
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Outline
Dimensions
in. (mm)
Height
in. (mm)
Mounting
Hole
Pattern
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
TO-3
Weight
lbs. (grams)
641A
641K
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
1.000 (25.4)
1.000 (25.4)
(1) TO-3
None
36擄C @ 15W
36擄C @ 15W
0.9擄C/W @ 250 LFM
0.9擄C/W @ 250 LFM
0.2900 (131.54)
0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
641 SERIES
(EXTRUSION PROFILE 1371)
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
50
Normally stocked
1
2
3
4
5
6
7
