SERIES CMOS DEVICES鈥?/div>
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
(Micro Package)
C1
(Plastic Chip Carrier)
ORDER CODES :
HCC40XXBF
HCF40XXBM1
HCF40XXBEY
HCF40XXBC1
DESCRIPTION
The
HCC4011B, HCC4012B
and
HCC4023B
(ex-
tended temperature range) and
HCF4011B,
HCF4012B
and
HCF4023B
(intermediate tempera-
ture range) are monolithic, integrated circuit, avail-
able in 14-lead dual in-line plastic or ceramic
package and plastic micropackage.
PIN CONNECTIONS
4011B
The
HCC/HCF4011B, HCC/HCF4012B
and
HCC/HCF4023B
NAND gates provide the system
designer with direct implementation of the NAND
function and supplement the existing family of
COS/MOS gates. All inputs and outputs are buf-
fered.
4012B
4023B
June 1989
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