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High temperature soldering guaranteed:
260擄C/10 seconds at 5 lbs. (2.3kg) tension
0.034 (8.6)
0.028 (7.6)
DIA.
MECHANICAL DATA
0.105 (2.67)
0.085 (2.16)
0.200 (5.08)
0.180 (4.57)
Polarity shown on front side of case: positive lead by beveled corner
Case:
Molded plastic body over passivated junctions
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
Polarity symbols marked on case
Mounting position:
Any
Weight:
0.06 ounce, 1.7 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
KBP
KBP
005M
01M
SYMBOLS 3N246 3N247
KBP
02M
3N248
KBP
04M
3N249
KBP
06M
3N250
KBP
08M
3N251
KBP
10M
3N252
UNITS
* Maximum repetitive peak reverse voltage
* Maximum RMS voltage
* Maximum DC blocking voltage
Maximum average forward output rectified current at T
A
=40擄C
* Peak forward surge current single half sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing (t < 8.3ms)
* Maximum instantaneous forward voltage drop
* Maximum DC reverse current
at rated DC blocking voltage per leg
Typical junction capacitance per leg
(NOTE 1)
Typical thermal resistance per leg
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
I
2
t
at 1.0A per leg
1.57A per leg
T
A
=25擄C
T
A
=125擄C
V
F
I
R
C
J
R
螛JA
R
螛JL
T
J
, T
STG
50
35
50
100
70
100
200
140
200
400
280
400
1.5
50.0
30.0
10.0
1.0
1.3
5.0
500.0
15.0
40.0
13.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
A
2
sec
Volts
碌A(chǔ)
pF
擄C/W
擄C
T
J
=150擄C
* Operating junction and storage temperature range
-55 to +150
NOTES:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with, 0.47 x 0.47" (12 x12mm) copper pads
* JEDEC registered values
4/98
1
2
