PRELIMINARY
1.28 Gbit SDRAM
ELECTRONICS
3DSD1280-323H
1.28 GBit Synchronous DRAM - Hermetic package
Features
Organized as 40M x 32-bit.
Single +3.3V 鹵0.3V power supply
Two stacks of ten 64 MBit SDRAM mounted
on ceramic hermetic package
Fully synchronous; all signals registered on
positive edge of system clock.
Internal pipelined operation; column address
can be changed every clock cycle.
Programmable burst lengths: 1, 2, 4, 8 or full
page.
Auto Precharge, includes Concurrent Auto
Precharge, and Auto Refresh Modes.
Self Refresh Mode
LVTTL - compatible inputs and outputs
Vcc and Vss are decoupled with four 10nF
and four 100nF capacitors inside the module
MIL-STD-883D Class S screening -
temperature range : -15擄C to +80擄
Pin configuration for
3DSD1024-0863S
GND
NC/A12*
DQM
BS1
BS0
A11
A10
A9
A8
GND
NC
Vcc
A7
A6
A5
A4
A3
A2
A1
A0
Vcc
A0-A12*
64
63
General Description
The 3DSD1280-323H is a highly integrated Synchro-
nous Dynamic Random Access Memory ceramic mo-
dule, containing 1,342,177,280 bits. It is organized
with ten banks of 128 Mbit. Each Bank has a 32-bit in-
terface, and is selected with specific CS#. All other si-
gnals are common to the twenty 64 MBit SDRAM
memories.
It is particularly well suited for use in high performance
and high density aerospace applications, such as solid
state recorder for airbornes and satellites.
The 3DSD1280-323H is packaged in a 84-pin CQFJ.
Pin Description
DQ0-DQ31
Data Inputs/Outputs
Address
Column Address Select
Row Address Select
Write Enable
Chip Select
Bank Address Input
Clock
Clock Enable
Input/Output Mask
Power (+3.3v)
Ground
No Connection
84
1
CAS#
RAS#
WE#
CS0# - CS9#
BS0,BS1
CLK
CKE
DQM
Vcc
GND
NC
Vcc
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
Vcc
NC
GND
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
GND
21
TOP VIEW
GND
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
GND
NC
Vcc
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Vcc
43
Block Diagram
VCC
CLK
RAS
CAS
WE
DQ[0...15]
A[0...12]
Vcc
NC
CLK
WE#
CAS#
CS6#
CS5#
CS4#
CS3#
CS2#
CS1#
CS0#
CKE
GND
22
RAS#
CS9#
CS8#
CS7#
Vcc
NC
GND
42
* : A12 is a provision for 256Mb components extension
CLK
RAS
CAS
WE
CS[0...9]
CKE
UDQM
LDQM
VCC DQ[0...15]
A[0...11]
BSO
BS1
A12/NC
GND
VCC
CLK
DQ[0...15]
RAS
CAS
A[0...11]
WE
BSO
CS[0...9]
BS1
CKE
A12/NC
UDQM
LDQM
GND
BSO
BS1
CS[0...9]
CKE
DQM
GND
3D PLUS,
641 rue H茅l貓ne Boucher - ZI
F-78532 BUC Cedex FRANCE
Tel : 33 (0)1 30 83 26 50 FAX : 33 (0)1 39 56 25 89
Web : http://www. 3d-plus.com
3DFP-0008
Rev : 2
December 1999
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