Base Current 鈭?/div>
Continuous
Peak
7.5
15
5.0
15
Total Device Dissipation @ T
C
= 25擄C
Derate above 25擄C
Operating and Storage Junction
Temperature Range
P
D
150
0.855
W
W/擄C
擄C
T
J
, T
stg
鈥?65 to + 200
TO鈭?04AA (TO鈭?)
CASE 1鈭?7
STYLE 1
2N377xG
AYYWW
MEX
2N377x
G
A
YY
WW
MEX
THERMAL CHARACTERISTICS
Characteristic
Symbol
q
JC
Max
Unit
Thermal Resistance,
Junction鈭抰o鈭扖ase
1.17
擄C/W
= Device Code
x = 1 or 2
= Pb鈭扚ree Package
= Assembly Location
= Year
= Work Week
= Country of Origin
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates JEDEC registered data.
ORDERING INFORMATION
Device
2N3771
2N3771G
2N3772
2N3772G
Package
TO鈭?04
TO鈭?04
(Pb鈭扚ree)
TO鈭?04
TO鈭?04
(Pb鈭扚ree)
Shipping
100 Units / Tray
100 Units / Tray
100 Units / Tray
100 Units / Tray
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2006
1
October, 2006 鈭?Rev. 11
Publication Order Number:
2N3771/D