27LV256
256K (32K x 8) Low-Voltage CMOS EPROM
FEATURES
鈥?Wide voltage range 3.0V to 5.5V
鈥?High speed performance
- 200 ns access time available at 3.0V
鈥?CMOS Technology for low power consumption
- 8 mA Active current at 3.0V
- 20 mA Active current at 5.5V
- 100
碌
A Standby current
鈥?Factory programming available
鈥?Auto-insertion-compatible plastic packages
鈥?Auto ID aids automated programming
鈥?Separate chip enable and output enable controls
鈥?High speed 鈥淓xpress鈥?programming algorithm
鈥?Organized 32K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC package
- 28-pin SOIC package
- 28-pin VSOP package
- Tape and reel
鈥?Data Retention > 200 years
鈥?Available for the following temperature ranges:
- Commercial:
0藲C to +70藲C
- Industrial:
-40藲C to +85藲C
PACKAGE TYPES
PDIP
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
鈥?
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
4
3
2
1
32
31
A6
A5
A4
A3
A2
A1
A0
NC
O0
30
A7
A12
V
PP
NU
Vcc
A14
A13
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
29
28
27
26
25
24
23
22
21
PLCC
A8
A9
A11
NC
OE
A10
CE
O7
O6
SOIC
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
O1
O2
V
SS
NU
O3
O4
O5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
27LV256
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DESCRIPTION
The Microchip Technology Inc. 27LV256 is a low volt-
age (3.0 volt) CMOS EPROM designed for battery
powered applications. The device is organized as a
32K x 8 (32K-Byte) non-volatile memory product. The
27LV256 consumes only 8 mA maximum of active cur-
rent during a 3.0 volt read operation therefore improv-
ing battery performance. This device is designed for
very low voltage applications where conventional 5.0
volt only EPROMS can not be used. Accessing individ-
ual bytes from an address transition or from power-up
(chip enable pin going low) is accomplished in less than
200 ns at 3.0V. This device allows systems designers
the ability to use low voltage non-volatile memory with
today鈥檚' low voltage microprocessors and peripherals
in battery powered applications.
A complete family of packages is offered to provide the
most 鏗俥xibility in applications. For surface mount appli-
cations, PLCC, VSOP or SOIC packaging is available.
Tape and reel packaging is also available for PLCC or
SOIC packages.
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
VSOP
OE
A11
A9
A8
A13
A14
V
CC
V
PP
A12
A7
A6
A5
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
O7
O6
O5
O4
O3
V
SS
O2
O1
O0
A0
A1
A2
27LV256
漏
1996 Microchip Technology Inc.
DS11020F-page 1
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