, for industrial ambient temperature.
C. Maximum value: +85
鈥淐ommercial鈥?to 鈥淐ommercial and Industrial.鈥?/div>
I
On page 56, in the section titled 鈥淭hermal Charac-
teristics,鈥?change 鈥淭he 脡lanSC520 microcontroller
is...鈥?to 鈥溍塴anSC520 microcontroller commercial
temperature devices are...鈥?in the first sentence.
I
On page 57, replace Table 15 with the updated ver-
sion reproduced below. This new table adds a new
row for T
CASE
= 100
擄
C.
I
On page 59, in the heading 鈥淪witching Characteris-
tics over Commercial Operating Ranges,鈥?change
鈥淐ommercial鈥?to 鈥淐ommercial and Industrial.鈥?/div>
Table 15. Maximum T
A
for Plastic BGA Package with 6-Layer Board
1
T
CASE
85擄C
100擄C
2
CPU Clock Rate
133 MHz
100 MHz
100 MHz
Airflow (Linear Feet Per Minute)
0
67.3擄C
70.1擄C
85.1擄C
200
69.8擄C
72.2擄C
87.2擄C
400
71.3擄C
73.5擄C
88.5擄C
600
72.2擄C
74.3擄C
89.3擄C
800
72.7擄C
74.7擄C
89.7擄C
Notes:
1. The board type is described in the JEDEC standards document entitled
Thermal Test Chip Guide-
line (Wire Bond Type Chip)
at www.jedec.org. On the home page click on the link Free Standards
and Docs, and then click on the document link JESD51-4 under JEDEC PUBLICATIONS.
2. T
CASE
= 100擄C data is for industrial temperature devices only.
漏 Copyright 2001 Advanced Micro Devices, Inc. All rights reserved.
Publication#
22003
Rev:
B
Amendment/1
Issue Date:
May 2001
1
2
