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High-Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Maximum Reflow Temperature: 260擄C
Extremely Small SOD-523 Package
http://onsemi.com
MAXIMUM RATINGS
(T
A
= 25擄C)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM(surge)
Max
100
200
500
Unit
V
mAdc
mAdc
1
CATHODE
2
ANODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
FR- 5 Board (Note 1)
T
A
= 25擄C
Derate above 25擄C
Thermal Resistance
Junction-to-Ambient
Junction and Storage Temperature
1. FR-4 @ Minimum Pad
Symbol
P
D
200
1.57
R
qJA
T
J
, T
stg
625
150
mW
mW/擄
C
擄C/W
擄C
A
d
Max
Unit
SOD-523
CASE 502
PLASTIC
MARKING DIAGRAM
ELECTRICAL CHARACTERISTICS
Characteristic
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(V
R
= 80 Vdc)
Diode Capacitance
(V
R
= 0.5 V, f = 1.0 MHz)
Forward Recovery Voltage
(I
F
= 100 mAdc)
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc)
I
R
-
C
D
V
F
t
rr
-
-
-
0.1
3.0
1.2
4.0
mAdc
pF
Vdc
ns
Symbol
Min
Max
Unit
A
d
= Specific Device Code
= Date Code
ORDERING INFORMATION
Device
1SS400T1
Package
SOD-523
Shipping
4 mm pitch
3000/Tape & Reel
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2003
1
June, 2003 - Rev. 0
Publication Order Number:
1SS400T1/D