1SMB5926 THRU 1SMB5956
SURFACE MOUNT SILICON ZENER DIODE
VOLTAGE - 11 TO 200 Volts
FEATURES
l
For surface mounted applications in order to
optimize board space
l
Low profile package
l
Built-in strain relief
l
l
l
l
l
Glass passivated junction
Low inductance
Typical I
R
less than 1
攏gA
above 11V
High temperature soldering :
260
壟J
/10 seconds at terminals
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
MECHANICAL DATA
Case: JEDEC DO-214AA Molded plastic over
passivated junction
Terminals: Solder plated, solderable per MIL-STD-750,
method 2026
Polarity: Color band denotes positive end (cathode)
Standard Packaging: 12mm tape (EIA-481)
Weight: 0.003 ounce, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
壟J
ambient temperature unless otherwise specified.
SYMBOL
DC Power Dissipation @ T
L
=75
壟J
, Measure at Zero Lead Length(Note 1, Fig. 1)
P
D
Derate above 75
壟J
Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated
I
FSM
load(JEDEC Method) (Note 1,2)
Operating Junction and Storage Temperature Range
T
J
,T
STG
NOTES:
1. Mounted on 5.0mm (.013mm thick) land areas.
2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses
per minute maximum.
3. ZENER VOLTAGE (Vz) MEASUREMENT Nominal zener voltage is measured with the device
function in thermal equilibrium with ambient temperature at 25
壟J
.
4.ZENER IMPEDANCE (Zz) DERIVATION Z
ZT
and Z
ZK
are measured by dividing the ac voltage drop across
the device by the accurrent applied. The specified limits are for I
Z(ac)
= 0.1 I
Z
, (dc) with the ac freqency = 60Hz.
2
Power - 1.5 Watts
DO-214AA
MODIFIED J-BEND
VALUE
1.5
15
10
-55 to +150
UNITS
Watts
mW/
壟J
Amps
壟J
1
2
3
