1SMB3EZ11 THRU 1SMB3EZ200
SURFACE MOUNT SILICON ZENER DIODE
VOLTAGE - 11 TO 200 Volts
FEATURES
l
For surface mounted applications in order to
optimize board space
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Low profile package
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Built-in strain relief
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l
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Glass passivated junction
Low inductance
Excellent clamping capability
Typical I
D
less than 1
攏g
A above 11V
High temperature soldering :
260
壟J
/10 seconds at terminals
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
Power - 3.0 Watts
DO-214AA
MODIFIED J-BEND
MECHANICAL DATA
Case: JEDEC DO-214AA, Molded plastic over
passivated junction
Terminals: Solder plated, solderable per
MIL-STD-750, method 2026
Polarity: Color band denotes positive end (cathode)
except Bidirectional
Standard Packaging: 12mm tape(EIA-481)
Weight: 0.003 ounce, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
壟J
ambient temperature unless otherwise specified.
SYMBOL
Peak Pulse Power Dissipation (Note A)
P
D
Derate above 75
壟J
Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated
I
FSM
load(JEDEC Method) (Note B)
Operating Junction and Storage Temperature Range
T
J
,T
STG
NOTES:
2
A. Mounted on 5.0mm (.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses
per minute maximum.
VALUE
3
24
15
-55 to +150
UNITS
Watts
mW/
壟J
Amps
壟J