鈾?/div>
High temperature soldering guaranteed:
450擄C/5 seconds at terminals.
Complete device submersible temperature of
265擄C for 10 seconds in solder bath
FEATURES
P
A
T
E
N
T
E
MECHANICAL DATA
Case:
JEDEC DO-213AB molded plastic over glass body
Terminals:
Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity:
Two bands indicate cathode end - 1st band
denotes device type and 2nd band denotes repetitive peak
reverse voltage rating
Mounting Position:
Any
Weight:
0.0046 ounce, 0.116 gram
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
Standard recovery time device: 1st band is White
Polarity color bands
(2nd Band)
SYMBOLS
1N
6478
1N
6479
1N
6480
1N
6481
1N
6482
1N
6483
1N
6484
UNITS
Gray
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
Red
100
70
100
Orange Yellow Green
200
140
200
400
280
400
1.0
30.0
600
420
600
Blue
800
560
800
Violet
1000
700
1000
Volts
Volts
Volts
Amp
Amps
* Maximum repetitive peak reverse voltage
Maximum RMS voltage
* Maximum DC blocking voltage
* Maximum average forward rectified current at
* Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load at T
A
=75擄C (JEDEC Method)
* Maximum instantaneous forward voltage at 1.0A
T
A
=25擄C
T
A
=75擄C
* Maximum DC reverse current
at rated DC blocking voltage
T
A
=25擄C
T
A
=125擄C
V
F
1.1
1.0
10.0
200.0
100.0
8.0
50.0
20.0
-65 to +175
Volts
碌A(chǔ)
碌A(chǔ)
pF
擄C/W
擄C
I
R
I
R(AV)
C
J
R
螛JA
R
螛JT
T
J
, T
STG
* Maximum full load reverse current, full cycle
average at T
A
=75擄C
* Typical junction capacitance
* Maximum thermal resistance
(NOTE 1)
(NOTE 2)
(NOTE 3)
* Operating junction and storage temperature range
NOTES:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Thermal resistance from junction to terminal, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
(3) Thermal resistance from junction to ambient, 0.24 x 0.24鈥?(6.0 x 6.0mm) copper pads to each terminal
* JEDEC Registered Values
4/98
VISHAY
1
2
