鈻?/div>
UIM Interface (Universal Identify Module)
DESCRIPTION
The EMIF03-SIM01F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic interfer-
ences. The EMIF03 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
鈻?/div>
EMI symmetrical (I/O) low-pass filter
鈻?/div>
High efficiency in EMI filtering
鈻?/div>
Lead free package
鈻?/div>
Very low PCB space consuming:
1.42mm x 1.42mm
鈻?/div>
Very thin package: 0.65 mm
鈻?/div>
High efficiency in ESD suppression
鈻?/div>
High reliability offered by monolithic integration
鈻?/div>
High reducing of parasitic elements through
integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Flip-Chip
(8 Bumps)
Table 1: Order Code
Part Number
EMIF03-SIM01F2
Marking
FC
Figure 1: Pin Configuration (Ball side)
3
RST
in
2
RST
out
1
A
CLT
out
CLT
in
Gnd
B
C
Data
in
V
CC
Data
out
Figure 2: Configuration
V
CC
100
鈩?/div>
RST in
R1
47
鈩?/div>
CLK in
R2
100
鈩?/div>
Data in
R3
Data out
CLK out
RST out
Cline = 35pF max.
GND
TM:
IPAD is a trademark of STMicroelectronics.
December 2004
REV. 2
1/7
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