鈮?/div>
碌s)
Total Power Dissipation @ TC = 25擄C
Derate above 25擄C
Total Power Dissipation @ TA = 25擄C, when mounted to minimum recommended pad size
Operating and Storage Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche Energy 鈥?Starting TJ = 25擄C
(VDD = 80 Vdc, VGS = 10 Vdc, IL = 7.5 Apk, L = 3.0 mH, RG = 25
鈩?
Thermal Resistance 鈥?Junction to Case
鈥?Junction to Ambient
鈥?Junction to Ambient, when mounted to minimum recommended pad size
Maximum Temperature for Soldering Purposes, 1/8鈥?from case for 10 seconds
Symbol
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
Value
250
250
鹵
20
鹵
40
5.0
3.2
15
50
0.4
1.75
鈥?55 to 150
84
2.50
100
71.4
260
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
W/擄C
Watts
擄C
mJ
擄C/W
TJ, Tstg
EAS
R
胃JC
R
胃JA
R
胃JA
TL
擄C
Designer鈥檚 Data for 鈥淲orst Case鈥?Conditions
鈥?The Designer鈥檚 Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves 鈥?representing boundaries on device characteristics 鈥?are given to facilitate 鈥渨orst case鈥?design.
E鈥揊ET and Designer鈥檚 are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 1
漏
Motorola TMOS
Motorola, Inc. 1995
Power MOSFET Transistor Device Data
1