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LUCL9500AGF-D Datasheet

  • LUCL9500AGF-D

  • High-Voltage Ringing SLIC for VolP Applications

  • 32頁

  • AGERE

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上傳產(chǎn)品規(guī)格書

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Preliminary Data Sheet
September 2001
L9500A
High-Voltage Ringing SLIC for VoIP Applications
Absolute Maximum Ratings
(@ T
A
= 25 擄C)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
dc Supply (V
CC
)
Battery Supply (V
BAT1
)
Battery Supply (V
BAT2
)
Logic Input Voltage
Logic Output Voltage
Operating Temperature Range
Storage Temperature Range
Relative Humidity Range
PT or PR Fault Voltage (dc)
PT or PR Fault Voltage (10 x 1000
碌s)
Ground Potential Difference (BGND to AGND)
Symbol
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
V
PT
, V
PR
V
PT
, V
PR
鈥?/div>
Min
鈥?.5
鈥?/div>
鈥?/div>
鈥?.5
鈥?.5
鈥?0
鈥?0
5
V
BAT
鈥?5
V
BAT
鈥?15
鈥?/div>
Max
7.0
鈥?0
V
BAT1
V
CC
+ 0.5
V
CC
+ 0.5
125
150
95
3
15
鹵1
Unit
V
V
V
V
V
擄C
擄C
%
V
V
V
Note: The IC can be damaged unless all ground connections are applied before, and removed after, all other connections. Furthermore, when
powering the device, the user must guarantee that no external potential creates a voltage on any pin of the device that exceeds the
device ratings. For example, inductance in a supply lead could resonate with the supply filter capacitor to cause a destructive overvolt-
age.
Table 4. Recommended Operating Characteristics
Parameter
5 V dc Supplies (V
CC
)
3 V dc Supplies (V
CC
)
High Office Battery Supply (V
BAT1
)
Auxiliary Office Battery Supply (V
BAT2
)
Operating Temperature Range
Table 5. Thermal Characteristics
Parameter
Thermal Protection Shutdown (T
jc
)
28 PLCC Thermal Resistance Junction to Ambient (胃
JA
)
1, 2
:
Natural Convection 2S2P Board
Natural Convection 2S0P Board
Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S2P Board
Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S0P Board
48 MLF Thermal Resistance Junction to Ambient (胃
JA
)
1, 2
:
Min
150
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Typ
165
35.5
50.5
31.5
42.5
38
Max
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Unit
擄C
擄C/W
擄C/W
擄C/W
擄C/W
擄C/W
Min
鈥?/div>
3.13
鈥?0
鈥?2
鈥?0
Typ
5.0
3.3
鈥?0
鈥?/div>
25
Max
5.25
鈥?/div>
鈥?5
V
BAT1
85
Unit
V
V
V
V
擄C
1. This parameter is not tested in production. It is guaranteed by design and device characterization.
2. Airflow, PCB board layers, and other factors can greatly affect this parameter.
Agere Systems Inc.
11

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