UPD6600AGS Datasheet

IC型號(hào)：
UPD6600AGS
PDF描述：
4-BIT SINGLE-CHIP MICROCONTROLLER FOR REMOTE CONTROL TRANSMI...
文件大?。?/label>
170.79KB
PDF頁(yè)數(shù)：
36頁(yè)
芯片廠家：
NEC

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上傳產(chǎn)品規(guī)格書

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碌

PD6124A, 6600A

25. RECOMMENDED SOLDERING CONDITIONS

It is recommended that

碌

PD6124A and 6600A be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document 鈥淪emiconductor

Device

Mounting Technology Manual鈥?/div>

(C10535E).

For other soldering methods and conditions, consult NEC.

Table 25-1. Soldering Conditions of Surface-Mount Type

碌

PD6124AGS-XXX: 20-pin plastic SOP (300 mil)

碌

PD6600AGS-XXX: 20-pin plastic SOP (300 mil)

Soldering Method

Infrared Reflow

VPS

Soldering Conditions

Package peak temperature: 230擄C, time: 30 seconds max. (210擄C min.), number of times: 1

Package peak temperature: 215擄C, time: 40 seconds max. (200擄C min.), number of times: 1

Soldering bath temperature: 260擄C max., time: 10 seconds max., number of times: 1

Pre-heating temperature: 120擄C max. (package surface temperature)

Partial Heating

Pin temperature: 300擄C max., time: 3 seconds max. (per side)

WS60-00-1

Symbol for

Recommended Condition

IR30-00-1

VP15-00-1

Wave Soldering

鈥?/div>

Caution

Do not use two or more soldering methods in combination (except the partial heating method).

Table 25-2. Soldering Conditions of Through-Hole Type

碌

PD6124ACS-XXX: 20-pin plastic shrink DIP (300 mil)

碌

PD6600ACS-XXX: 20-pin plastic shrink DIP (300 mil)

Soldering Method

Wave Soldering (Only for pin part)

Partial Heating

Soldering Conditions

Soldering bath temperature: 260擄C max., time: 10 seconds max.

Pin temperature: 300擄C max., time: 30 seconds max.

Caution

The wave soldering must be performed at the pin part only. Note that the solder must not be directly

contacted to the package body.

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UPD6600AGS Datasheet

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