. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 鈥?8 V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2 V
鈮?/div>
25擄C:
Unmounted device (see Figure 3) . . . . . . . . . . . . . . 825 mW
Mounted device (see Figure 3) . . . . . . . . . . . . . . . . 1150 mW
Operating free-air temperature range, T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 鈥?20擄C to 45擄C
Storage temperature range, T
STG
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 鈥?55擄C to 125擄C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260擄C
鈥?Stresses beyond those listed under 鈥渁bsolute maximum ratings鈥?may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under 鈥渞ecommended operating conditions鈥?is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for
voltage levels only.
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1500
1400
1300
PD 鈥?Power Dissipation 鈥?mW
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
0
10
20
30
40
50
60
70
TA 鈥?Free-Air Temperature 鈥?/div>
擄C
Unmounted Device
Mounted Device
(see Note A)
Figure 3
NOTE A: The mounted-device derating curve in Figure 3 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch run dimensions 鈥?DW package 鈥?All 20 etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
4
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
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