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UPC2800AGR Datasheet

  • UPC2800AGR

  • PREAMPLIFIER FOR INFRARED REMOTE CONTROL

  • 12頁

  • NEC   NEC

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上傳產(chǎn)品規(guī)格書

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碌
PC2800A
7. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document
Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface Mount Type
碌
PC2800AGR: 8-pin plastic SOP (225 mil)
Process
Infrared ray reflow
Conditions
Peak temperature: 230
擄C
or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
擄C
or higher),
Maximum number of reflow processes: 1 time.
VPS
Peak temperature: 215
擄C
or below (Package surafce temperature),
Reflow time: 40 seconds or less (at 200
擄C
or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260
擄C
or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
擄C
or below (Package surface temperature).
Partial heating method
Pin temperature: 300
擄C
or below,
Heat time: 3 seconds or less (Per each side of the device).
鈥?/div>
VP15-00-1
Symbol
IR30-00-1
Wave soldering
WS60-00-1
Caution Apply only one kind of soldering condition to a device, except for 鈥減artial heating method鈥?
or the device will be damaged by heat stress.
10

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