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MC34701EK Datasheet

  • MC34701EK

  • Freescale Semiconductor, Inc [1.5 A Switch-Mode Power Suppl...

  • 860.05KB

  • FREESCALE

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MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Electrical Ratings
Supply Voltage
Switching Node Voltage
Buck Regulator Bootstrap Input Voltage (BOOT - SW)
Boost Regulator Output Voltage
Boost Regulator Drain Voltage
RST
Drain Voltage
Symbol
Value
Unit
V
IN1
, V
IN2
V
SW
V
IN(BOOT)
V
BST
V
BD
V
RST
-0.3 to 7.0
-1.0 to 7.0
-0.3 to 8.5
-0.3 to 8.5
-0.3 to 9.5
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 7.0
V
V
V
V
V
V
V
V
V
Enable Terminal Voltage at EN1, EN2
Logic Terminal Voltage at SDA, SCL
Analog Terminal Voltage
LDO, VOUT,
RST
LDRV, LCMP, CS
Terminal Voltage at CLKSEL, ADDR, RT, FREQ, VDDI, CLKSYN, INV,
LFB
ESD Voltage
(1)
Human Body Model
Machine Model
Thermal Ratings
Storage Temperature
Lead Soldering Temperature
(2)
Maximum Junction Temperature
Thermal Resistance
Junction to Ambient (Single Layer)
(3)
,
(4)
Junction to Ambient (Four Layers)
(3)
,
(4)
Thermal Resistance, Junction to Base
(5)
Operational Package Temperature (Ambient Temperature)
V
EN
V
LOG
V
OUT
V
LIN
V
LOGIC
-0.3 to 7.0
-0.3 to 8.5
-0.3 to 3.6
V
V
V
ESD
鹵2000
鹵200
T
STG
T
SOLDER
T
JMAX
R
胃JA
-65 to 150
260
125
擄C
擄C
擄C
擄C/W
70
55
R
胃JB
T
A
18
-40 to 85
擄C/W
擄C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
鈩?,
ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
鈩?,
and the Charge Device Model.
2. Lead soldering temperature limit is for 10 seconds maximum duration.
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
4. Per JEDEC JESD51-6 with the board horizontal
5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34701
Analog Integrated Circuit Device Data
Freescale Semiconductor
5

MC34701EK 產(chǎn)品屬性

  • 42

  • 集成電路 (IC)

  • PMIC - 穩(wěn)壓器 - 專用型

  • -

  • 轉(zhuǎn)換器，F(xiàn)reescale 電源 QUICC? I，II

  • 2.8 V ~ 6 V

  • 1

  • 可調(diào)

  • -40°C ~ 85°C

  • 表面貼裝

  • 32-SOIC（0.295"，7.50mm 寬）

  • 32-SOIC

  • 管件

  • KIT33701DWBEVB-ND - KIT FOR 33701 POWER SUPPLY

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