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LQG10A1N2S00 Datasheet

  • LQG10A1N2S00

  • Murata Manufacturing Co., Ltd. [CHIP COIL]

  • 686.65KB

  • MURATA   MURATA

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This is the PDF file of catalog No.O05E-5.
No.O05E5.pdf 00.3.15
Notice of Chip Coil
2. Mounting Instructions
1Land
Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions c and d shown below) cause floating and
electrode cracks.
Land
Solder Resist
4Amount
of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is applied
as shown below.
c
LQH/LQN
d
LQS
2Magnetic
Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may cause
magnetic coupling.
(Please refer to Page 54 for coil-to-coil spacing and
coupling coefficient.)
The LQS and LQG series have a magnetically shielded
structure. The structure makes their coupling coefficient
smaller than that of conventional chip coils. In particular,
the LQS33N series has a very small coupling coefficient.
Magnetic Coupling
LQP/LQG
LQW
"Standard
thickness of solder paste : 200 to 300碌m
(LQP10A : 100碌m, LQG Series, LQP11A/LQW1608A :
100碌m to 150碌m)
5Amount
of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions.
3PCB
Warping
Arrange chip coils to minimize stress caused by PCB
warping.
LQH/LQN
LQG
Fig. 1
Fig. 2
LQG11N
LQG21N/21C/21F
LQG3216F
LQN21A
LQH1N/1C
LQN1A/1H
LQH3N/3C
LQH(N)4N/4C
Typical Application Amount (in mg)
UVS-50R-2
NF-3000
MR-8153RA
0.06Y0.07
0.06Y0.07
0.05Y0.06
0.20Y0.25
0.20Y0.25
0.15Y0.20
0.25Y0.30
0.25Y0.30
0.20Y0.25
0.21Y0.23
0.21Y0.23
0.16Y0.18
0.18Y0.20
0.20Y0.23
0.45Y0.50
0.20Y0.25
0.27Y0.35
0.60Y0.80
0.20Y0.25
0.27Y0.35
0.60Y0.80
The arrangement shown in Fig. 2 is more effective in
preventing stress than that shown in Fig. 1.
43

LQG10A1N2S00 PDF文件相關型號

LQG10A2N2S00,LQG10A33NJ00,LQG10A5N6S00,LQG11A12NJK00,LQG11A15NJK00,LQG11A1N5S00,LQG11A2N2S00,LQG11A3N3S00,LQG11A47NJ00,LQG11A47NJK00,LQG11A56NJ00,LQG11A5N6S00,LQG11A8N2J00,LQG11A8N2JK00,LQG11N1R2K00,LQG11N1R5K00,LQG11NR12K00,LQG11NR56K00,LQG21N1R2K10,LQG21N2R2K10,LQG21NR33K10,LQG21NR56K10,LQH1N100K04,LQH1N150K04,LQH1N1R2K04,LQH1N1R8K04,LQH1N2R2K04,LQH1N3R3KJ04,LQH1N560K04,LQH1N5R6K04,LQH1NR22K04,LQH3N100K34,LQH3N120K34,LQH3N180K34,LQH3N1R2M34,LQH3N1R8K34,LQH3N220K34,LQH3N270KJ34,LQH3N271KJ34,LQH3N2R7K34,LQH3N391K34,LQH3N470K34,LQH3N561KJ34,LQH3N5R6K34,LQH3N6R8K34,LQH3N820KJ34,LQH3N8R2K34,LQH3NR56M34,LQH3NR68M34,LQH3NR82M34,LQH4N101K04,LQH4N121K04,LQH4N122K04,LQH4N122KJ04,LQH4N1R2M04,LQH4N220K04,LQH4N221KJ04,LQH4N3R3M04,LQH4N470K04,LQN4N182KJ04,LQP10A1N6BC00,LQP10A22NGJ00,LQP10A33NG00,LQP10A3N6B00,LQS33N2R7G04,LQS33N8R2G04,LQW1608A13NJG00

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