LT6003/LT6004/LT6005
PACKAGE DESCRIPTION
DC Package
4-Lead Plastic DFN (2mm
脳
2mm)
(Reference LTC DWG # 05-08-1724 Rev A)
1.30
鹵0.05
2.00
鹵0.05
1.35
鹵0.05
1.00
鹵0.05
PACKAGE
OUTLINE
0.25
鹵
0.05
0.45 BSC
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDEDED
R = 0.05
TYP
1.35
鹵
0.10
1.00
鹵
0.10
R = 0.115
TYP
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
2.00
鹵0.10
(4 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.25
脳
45擄
CHAMFER
1
0.23
鹵
0.05
0.45 BSC
0.40
鹵0.05
0.200 REF
0.75
鹵0.05
0.70
鹵0.05
4
1.35 REF
BOTTOM VIEW鈥擡XPOSED PAD
(DC4) DFN 0506 REV A
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.00 鈥?0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.62
MAX
0.95
REF
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 鈥?1.75
(NOTE 4)
PIN ONE
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.30 鈥?0.45 TYP
5 PLCS (NOTE 3)
0.95 BSC
0.80 鈥?0.90
0.20 BSC
1.00 MAX
DATUM 鈥楢鈥?/div>
0.01 鈥?0.10
0.30 鈥?0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
0.09 鈥?0.20
(NOTE 3)
1.90 BSC
S5 TSOT-23 0302 REV B
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
600345f
17
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