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MC33886 Datasheet

  • MC33886

  • 5.0 A H-Bridge

  • 451.79KB

  • Motorola   Motorola

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Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Supply Voltage
Input Voltage (Note 1)
FS Status Output (Note 2)
Continuous Current (Note 3)
ESD Voltage for DH Package
Human Body Model (Note 4)
Machine Model (Note 5)
ESD Voltage for VW Package
V
ESD1
V
ESD2
V
ESD1
V
ESD2
T
STG
T
A
T
J
T
SOLDER
220
260
R
JB
~5.0
擄C/W
鹵2000 (Note 6)
鹵200
V
鹵2000
鹵200
-65 to 150
-40 to 125
-40 to 150
擄C
擄C
擄C
擄C
Symbol
V+
V
IN
V
FS
I
OUT
Value
40
-0.1 to 7.0
7.0
5.0
Unit
V
V
V
A
V
Freescale Semiconductor, Inc...
Human Body Model (Note 4)
Machine Model (Note 5)
Storage Temperature
Ambient Operating Temperature (Note 7)
Operating Junction Temperature
Terminal Soldering Temperature (Note 8)
DH Suffix
VW (Pb-Free Suffix)
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) (Note 9)
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS terminal may cause permanent damage to the device.
Continuous current capability so long as junction temperature is
鈮?/div>
150
C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
鈩?.
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
鈩?.
All terminals are capable of Human Body Model ESD voltages of 鹵2000 V with two exceptions pertaining only to the DH suffix package:
(1) D2 to PGND is capable of 鹵1500 V and (2) OUT1 to AGND is capable of 鹵1000 V.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
33886
4
MOTOROLA ANALOG
For More Information On This Product,
INTEGRATED CIRCUIT DEVICE DATA
Go to: www.freescale.com

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