Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
DH SUFFIX
VW (Pb-FREE) SUFFIX
20-TERMINAL HSOP
PLASTIC PACKAGE
CASE 979C-02
ISSUE A
PIN ONE ID
h
X 45
擄
E2
1
20
E3
Freescale Semiconductor, Inc...
D
e/2
D1
10
11
EXPOSED
HEATSINK AREA
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND
IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS
THE PLASTIC BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.150 PER
SIDE. DIMENSIONS D AND E1 DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-.
5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL
IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE
-H-.
7. DIMENSION D DOES NOT INCLUDE TIEBAR PROTRUSIONS.
ALLOWABLE TIEBAR PROTRUSIONS ARE 0.150 PER SIDE.
D2
18X
B
e
E1
10X
E
A
E4
BOTTOM VIEW
MILLIMETERS
DIM MIN
MAX
A
3.000 3.400
A1
0.100 0.300
A2
2.900 3.100
A3
0.00 0.100
D
15.800 16.000
D1
11.700 12.600
D2
0.900 1.100
E
13.950 14.450
E1
10.900 11.100
E2
2.500 2.700
E3
6.400 7.200
E4
2.700 2.900
L
0.840 1.100
L1
0.350 BSC
b
0.400 0.520
b1
0.400 0.482
c
0.230 0.320
c1
0.230 0.280
e
1.270 BSC
h
--- 1.100
q
0
擄
8
擄
aaa
0.200
bbb
0.100
bbb
Y
A A2
M
C B
H
DATUM
PLANE
b1
c
c1
b
C
SEATING
PLANE
aaa
GAUGE
PLANE
M
C A
SECTION W-W
L1
W
L
W
A1
A3
bbb C
q
(1.600)
DETAIL Y
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
33886
19